Deformation insensitive thermal conductance of the designed Si metamaterial

The thermal management has been widely focused due to its broad applications. Generally, the deformation can largely tune transport. main challenge of flexible electronics/materials is maintain conductance under large deformation. This work investigates a nano-designed Si metamaterial constructed with curved nanobeams by molecular dynamics simulation. Interestingly, it shows that insensitive (strain ∼ −41%). new feature comes from designed nanobeams, which exhibit quasi-zero stiffness. Further calculations show that, when deformation, average stress in nanobeam ultra-small (<151 MPa), and phonon density states are little changed. provides valuable insight on multifunction, such as both stable mechanical properties, metamaterials.